Optimal Adhesion For Any Products Made From Any Material

TECHNOMELT Solutions for Modern PCB and Circuitry Protection
TECHNOMELT Low Pressure Molding solutions are the benchmark for modern PCB and
circuitry protection. The simplicity of these products is their advantage: because the entire
TECHNOMELT operation takes place at low pressure, cycle time is short and fine or fragile
circuitry is not damaged. See how beneficial TECHNOMELT can be as an alternative for your
potting and encapsulating processes.

Henkel’s Low Pressure Molding materials deliver exceptional electrical insulation and excellent temperature,vibration and solvent resistance for many applications. The TECHNOMELT
product range protects electronics from the harshest environmental conditions, including high
humidity, long-term UV exposure and extreme thermal cycling.

Low Pressure Molding Technology

Low pressure molding is a faster and more efficient process than conventional potting.
TECHNOMELT is a one-part material that requires no mixing or curing; reduces material
consumption through streamlined, multi-level, contour-exact encapsulation; and offers a
sustainable solution through its unique re-usable formulation and green chemistry. Integrating TECHNOMELT as an alternative to potting also reduces part numbers by eliminating the
need for a housing or additional parts to achieve strain relief.

The Benefits

Henkel's TECHNOMELT product range has many beneficial aspects for your manufacturing:

• Fewer process steps
• Reduced equipment and operations footprint
• Faster cycle time per part
• Fewer machines and manufacturing lines
• Low-viscosity materials allow for low injection pressures

• The Process
• 
•  
• How does low pressure molding with TECHNOMELT work? It's really simple, because you are able to encapsulate your electronic products in only three steps:
•  
• 1.Insert bare electronics into your predesigned mold set
• 2.TECHNOMELT encapsulates electronics at low pressure and temperatures
• 3.Test parts and move them to final assembly — immediately after molding

Sustainable Pre-Applied Solutions for Threaded Parts
We provide pre-assembly coating on screws for the purpose of anti-self-loosening.
"Pre-applied" is a coating applied to threaded screws, bolts and pipe fittings which
is a dry-to-thouch thread locker or thread sealer.

https://www.youtube.com/watch?v=mJd6FW6vhdE&t=23s

When accuracy, speed and precision are demanded, manufacturers worldwide rely on Henkel’s
complete line of LOCTITE® adhesive dispensers and light curing equipment to enable them to
transition towards a more automated, integrated and effective manufacturing process. Across pneumatic,
volumetric and glue dispenser equipment,make sure it’s a LOCTITE®.

Our high-precision stainless steel, tapered polyethylene and flexible polypropylene dispensing needles/ dispensing tips all feature a positive locking, helical thread design to ensure the tip will stay intact during the toughest applications.

With a full range of Loctite® branded custom designed vacuum impregnation process equipment,
a variety of sealant products and comprehensive technical support, Henkel can meet every sealing need.
With an unmatched portfolio of LOCTITE products and our fully automated vacuum impregnation system, we can ensure that you no longer face the negative effects of porosities, such as cost of scrapping, loss of production, dissatisfied customers or even lost business. Our state-of-the-art impregnation technology gives you a permanent and reliable sealing solution to the problems of porosities and leakages.

-Impregnation process can effectively seal the pores of the parts.
-It provide the most reliable approach to solving porosity issue.

FESTO is a leading world-wide supplier of automation technology and the performance leader
in industrial training and education programs.
Our aim: maximised productivity and competitiveness for our customers.

Thermal management materials are a range of different product types designed to effectively dissipate heat in electronic applications. They are composite systems that enable efficient heat transfer within components.

These solutions perform various functions within components. This includes carrying heat away from the components that generate it (also known as dissipating heat), offering stress relief from thermal cycling, providing electrical insulation, filling gaps, and offering long-term stability within components. 

Thermal management materials have an important role to play as electronic devices become increasingly powerful and generate more heat. Without effective thermal management, manufacturers can face: 

• - System reliability drops
• - Product performance failure
• - Limited design advancement potential
• - Degradation over time
•  

Thermal management materials from Henkel are designed to fit a wide range of applications. But depending on what you’re manufacturing, the type of interface material you need will differ. Selecting the right thermal management solution is key to: 

• Optimizing heat dissipation
• Extending the life of components
• Upholding performance of devices
• Eliminating the risk of failure and performance drops

Selecting the right thermal management material for your application depends on several factors, including: 

• Heat dissipation requirements
• Adhesive qualities needed in assembly
• Whether a solid or liquid is more applicable
• The size of the gap that needs to be filled
• Gap topography and surface
• Component stress level requirements
• Physics, including application temperature and structure

Knowing the requirements in your application for each of the above can help you decide whether you need a resin, liquid, or solid-state thermal management solution and whether pads, liquids, adhesives, tapes, or films are the right thermal product for use in your assembly.

For more information on how to select the right thermal interface materials, check out our guide on selecting the right thermal material for your needs.