These materials provide unrivaled thermal and mechanical performance while inducing virtually zero stress on electronic components during assembly, helping you improve performance and reliability across your device assemblies.

Because they’re liquid mediums, thermal gap filler materials can conform to highly intricate topographies and multi-level surfaces. This allows them to deliver better wet-out for optimized thermal resistance, generally lower than more solid pad-based mediums. 

Application volume and pattern are completely adaptable to suit a wide range of applications.

SIL PAD products can be used in a wide range of applications. Choose the ideal product from the portfolio for your needs. Discover products available with or without adhesives, as well as silicone thermal interface and non-silicone material alternatives. SIL PAD products are available to buy in several formats, including rolls, sheets, tubes, and as custom die-cut parts.