Optimal Adhesion For Any Products Made From Any Material
When accuracy, speed and precision are demanded, manufacturers worldwide rely on Henkel’s
complete line of LOCTITE® adhesive dispensers and light curing equipment to enable them to
transition towards a more automated, integrated and effective manufacturing process. Across pneumatic,
volumetric and glue dispenser equipment,make sure it’s a LOCTITE®.
FESTO is a leading world-wide supplier of automation technology and the performance leader
in industrial training and education programs.
Our aim: maximised productivity and competitiveness for our customers.
Thermal management materials are a range of different product types designed to effectively dissipate heat in electronic applications. They are composite systems that enable efficient heat transfer within components.
These solutions perform various functions within components. This includes carrying heat away from the components that generate it (also known as dissipating heat), offering stress relief from thermal cycling, providing electrical insulation, filling gaps, and offering long-term stability within components.
Thermal management materials have an important role to play as electronic devices become increasingly powerful and generate more heat. Without effective thermal management, manufacturers can face:
- - System reliability drops
- - Product performance failure
- - Limited design advancement potential
- - Degradation over time
Thermal management materials from Henkel are designed to fit a wide range of applications. But depending on what you’re manufacturing, the type of interface material you need will differ. Selecting the right thermal management solution is key to:
- Optimizing heat dissipation
- Extending the life of components
- Upholding performance of devices
- Eliminating the risk of failure and performance drops
Selecting the right thermal management material for your application depends on several factors, including:
- Heat dissipation requirements
- Adhesive qualities needed in assembly
- Whether a solid or liquid is more applicable
- The size of the gap that needs to be filled
- Gap topography and surface
- Component stress level requirements
- Physics, including application temperature and structure
Knowing the requirements in your application for each of the above can help you decide whether you need a resin, liquid, or solid-state thermal management solution and whether pads, liquids, adhesives, tapes, or films are the right thermal product for use in your assembly.
For more information on how to select the right thermal interface materials, check out our guide on selecting the right thermal material for your needs.